Mechanic XGZ40 Solder Flux Soldering Paste

Mechanic XGZ40 solder paste consists of flux and solder microparticles of 20-38 microns. Suitable for surface soldering and repair of PCB, BGA, SMD, PGA components.

Features

• High viscosity. Does not spread when heated
• Clean, neat soldering without flux residue
• Convenient container with a syringe is convenient for spot application of the paste on the sites
• Mostly used for soldering without a soldering iron. You can use a hair dryer, hot table, infrared table and even a gas torch or lighter.
• Widely used in radio electronic industry for surface mounting of planar (SMD) components on printed circuit board

Characteristics

• Composition: Sn-63%, Pb-37%
• Flux: IPX3
• Capacity: 10ml
• Solder microparticles: 20-38 microns
• Melting point: 183 °C
• Weight: 35 g

Accessories

• 1 x Mechanic XGZ40 solder paste

How to use

1. Pre-cleaned and degreased PCB surface
2. Position the PCB horizontally
3. Squeeze some paste onto the soldering area and position the components
4. Heat the paste. When heated, the flux boils and the Mechanic XGZ40 paste shrinks in size. The solder balls that make up the paste will then begin to melt
5. After the heating is complete, the paste will solidify within a few seconds.